
ITO Coated Glass Substrate
Transparent conductive ITO glass with selectable resistance.
- Sheet resistance
- 5–100 Ω/sq typical
- Thickness
- 0.4–3 mm
Custom vacuum chamber design and manufacturing; technical supply of vacuum components, wafers, deposition targets and conductive glass.
Custom process chambers, KF–CF–ISO components, viewports, bellows and system integration.
Enter vacuum division →02 · SEMICONDUCTOR MATERIALSWafers, sputtering targets, evaporation materials, conductive glass and high-purity research materials.
Enter semiconductor division →Choose a product family, specify the technical requirements and combine products from different groups in one quotation list.
Si, SiO₂, GaAs, GaSb, GaN, SiC and sapphire substrates.
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Pure metals, alloys, oxides and ceramic targets with optional backing plate.
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ITO and FTO coated glass with selectable resistance and cut sizes.
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High-purity elemental source materials supplied with analysis documentation.
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Transparent conductive ITO glass with selectable resistance.
Prime, test and research-grade silicon substrates.

Aluminium quick clamp for joining two KF flanges.

High-purity Titanium (Ti) sputtering target for PVD and thin-film deposition.

Adesis designs and manufactures stainless-steel vacuum chambers for thin-film, plasma, optical-test and special R&D processes. Chamber volume, access doors, port layout, feedthroughs, viewports, pumping lines and instrument interfaces are evaluated together at the start of the project.
KF, CF and ISO connection hardware, viewports and flexible elements supplied individually or integrated into engineered assemblies.





Material, geometry, finish and application.
Technical team reviews the requested specification.
Analysis certificate and shipment documentation.
DAP or EXW shipment from Türkiye.
Customer names, project identities and production photographs remain confidential. These briefs describe representative engineering scopes reviewed by Adesis.
Coordinated source ports, substrate motion, viewport, gas inlet and pumping interfaces.
Clear aperture, window material, beam path, thermal load and instrumentation interfaces.
Serviceable port layout, sensor feedthroughs and mechanical provision for future integration.