Germanium (Ge) Sputtering Target
Germanium (Ge) Sputtering Target supplied in standard and custom planar geometries for magnetron sputtering. Diameter, thickness, purity, target condition and optional OFHC copper backing plate are reviewed against the cathode and process requirements.
Choose target size, purity and backing-plate requirement.
Complete the technical selections before adding the item. Unknown fields may remain blank; availability, lead time and commercial terms are confirmed in the quotation.
What do these options mean?
If you are unsure, choose the custom option in the RFQ. The technical team will clarify the required specification for the application.
Purity
The stated minimum fraction of the principal element or compound.
Backing plate
The support plate—typically OFHC copper—used for mounting and heat transfer.
Bonding
The thermal and mechanical joining process between target and backing plate.
Supply to technical specification; suitability and lead time are confirmed in the quotation.
State any required analysis certificate, drawing or test report. Available documents are confirmed for the product and delivery scope in the quotation.
Configure the requirement, not just the product name.
Built around the process.
Send the drawing, target value or process condition.
Our technical team will evaluate the feasible supply configuration before quotation.